Xiaomi Mi 7 will be among the first flagship smartphones to be powered by the upcoming Qualcomm Snapdragon 845 and is expected to be unveiled in Q1 in 2018. And until now we haven’t got much info about the specification and design of upcoming smartphone, but that changes today as some CAD rendered images along with some key specs have been leaked online.
Starting with the design, the images show that the Xiaomi Mi 7 will feature the fullview display with minimal bezels on the sides. There will be narrow bezels on the top and bottom with curved corners. At the back the smartphone will rock vertically placed dual cameras with dual flash LED in between and the rear panel is expected to be made out of the glass to support wireless charging. One that seems to be missing will be the fingerprint scanner which could mean the company might ditch it or embed the fingerprint scanner under the display.
According to the leak, the Xiaomi Mi 7 will sport a 5.8-inch AMOLED display with the in-trend 18:9 aspect ratio and have a resolution of Quad-HD (2560×1440 pixels) with Gorilla Glass 5 for protection. Aforesaid the smartphone will be powered by an octa-core Qualcomm Snapdragon 845 clubbed with Adreno 630GPU.
The handset is expected to come in two variants, base variants will have 6GB of RAM and 128GB of built-in storage and the premium variant will have 8GB of RAM and 256GB of internal storage. The Mi 7 will running on a 3950mAh battery and support dual-SIM dual-standby. It will bootup MIUI 9 based on the Android Oreo.
Moving on the optics, the smartphone will come with a vertical dual camera setup which will consist of a 19MP dual sensors with an aperture of f/1.7 and 4x optical zoom. To take better photos in low light conditions there should be a dual-tone dual-LED flash. For better selfie experience it would come with a 16MP front-facing sensor.