The Mobile processor giant, Qualcomm has been working on their new flagship chipset, Snapdragon 845. The upcoming chipset is expected to debut in the month of December at the second Snapdragon Technology Summit, which will be held at Maui Island, Hawaii. Ahead of the launch a report has surfaced online which leaks full details of the chipset.
According to the report, Qualcomm will still build their upcoming flagship chipset from 10nm process similar to its predecessor even though the company has already started testing their new 7nm process which was earlier rumored to be used for building all future Snapdragon processors.
However the chipset is expected to perform better as it will come 10nm LPE process, while the recently launched Samsung’s Exynos 9810 was built with stable 10nm LPP process. Moving on, the Snapdragon 845 will still be an octa-core processor. Four of them will be the Cortex-A75 and the other four will be Cortex-A53 cores.
As nowadays the smartphones are coming with high resolutions and bigger displays so to handle the graphical needs it will come with a new Adreno 630GPU. The chipset will support dual 25MP sensors on both front and rear. The connectivity will also be enhanced as it will come with an X20 baseband, support for 802.11 ad Wi-Fi, and have a maximum download speed of 1.2Gbps.