TP-Link is a big name when it comes to the network solutions, but they do not hold much experience in smartphone business. Last year the company has only released two mid-ranged smartphones Neffos X1 and Neffos X1 Max. And now, they seem to be working on a new flagship smartphone as the leaked configuration suggest it would be powered by Qualcomm Snapdragon 835.
The leaked image shows that the unnamed smartphone will come with 18:9 aspect ration and have curved edges on the side. As it has thin bezels on top and bottom, the fingerprint scanner has been placed on the rear panel under the vertical dual camera setup with flash on the side.
As per other leaked specs of the smartphone, it will sport a vertical dual camera setup which includes a 16MP sensor and another a telephoto 20MP sensor with 2x optical zoom. And will also have a 16MP selfie shooter. It is expected to come with 6GB of RAM along with the Qualcomm Snapdragon 835 SoC.
TP-Link normally manufacturers low-end and mid-tier smartphones, this smartphone will be their first flagship which could suggest that the company could change their strategy towards smartphone industry. No other details regarding the specification, pricing and release date are know to us at the moment.